Publishing Schedule

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International Schedule 2022

MonthIssueArticles DueClose dateShow dateShowWhereSpecial Editorial CoverageSpecial Bonus Distribution
Janaury22.111-Dec29-DecJanuary19 - 21Nepcon JapanTokyo Big Sight, JapanIndustry Milestones
IPC APEX Show Issue
January25 - 27IPC APEX ExpoSan Diego,  CA, USA
 February22.28-Jan14-JanJan - Feb31 - 3Pan Pacific Microelectronics SymposiumHonolulu, Hawaii
February9 - 11Semicon KoreaSoeul, South Korea
March22.312-Feb18-FebMarch7 - 10 IMAPS Device PackagingWeKoPa, ArizonaPost Show IPC APEX 
April22.412-Mar18-MarApril12-14Expo ElectronicaMoscow, RussiaSMTconnect Preshow Issue
April20-23Nepcon ChinaShanghai, China
May22.59-Apr15-AprMay10-12SMTconnectNuremberg, GermanySMTconnect Show IssueSMTconnect Show
Date TBCLTS ConferenceVirtual
June22.614-May20-MayJune15-17Semicon ChinaShanghai, China
June22-25Nepcon ThailandBangkok,Thailand
July22.714-Jun17-JunJuly11-14Semicon West/FlexTech ShowSan Francisco, CA, USA
July13-15Productronica, ChinaShanghai, China
July19-21Emax - Electronics Manufacturing ExpoPenang, Malaysia
August22.810-Jul15-JulAugust17-19Semicon Southeast AsiaPenang, Malaysia
September22.913-Aug19-AugSeptember14-16Semicon TaiwanTaipei, TaiwanSemicon Taiwan
September21-22SMTA GuardalajeraGuardalajera, MexicoSMTA Guardalajera Show Supplement
September21-23Productronica IndiaNoida, IndiaSMTA International Preshow Issue
October22.1017-Sept23-SeptOctober10-12Nepcon Asia (South China)Shenzhen, ChinaSMTA International Show Issue
November22.1117-Oct21-OctNovember2-3SMTA InternationalMinneapolis, MN, USA
November15-18Semicon EuropaMunich, GermanySemicon Europa
December22.1224-Nov18-NovDecemberTBDSemicon JapanTokyo, JapanPost Show SMTA International
January 202324-26PreShow IPC APEX ExpoSan Diego,  CA, USAPreShow IPC APEX EXPO 

Regular Coverage

Stencil Printing, Selective Soldering, Factory Automation, Low-Volume/ High-Mix Equipment, Rework and Repair, Thermal Interface Materials (TIMs), Chip Scale Packaging, Dispensing, Burework and Repair, ATE, Manufacturing Software, Vision Systems, MEMs, Bond Testing, VOC-Free Fluxes, BGA, Factory Robotics, Pick and Place, Bump Inspection, Flip Chip, Wafer Bumping, Printing, Die Bonders, Cleaning, 3D Printers, Die Placement, Reflow, Conformal Coatings, 3D Inspection, Wave Soldering, Counterfeit Components, WEEE & RoHS, Reflow, Depanelling, Routing, Handling Systems, Wire Bonding, Process Management Software, Rework Equipment, Advanced Substrates, 3D Circuits, Sensors, Bulk Feeders, Board Contamination, ESD Control, Testing 5G Boards, Preventing Warpage, Potting, Encapsulating and Underfilling, Low Temperature Solder Paste, Line Management Tools, Soldering for Harsh Environments, Cleaning and Surface Preparation.