Publishing Schedule

2024 International Schedule

IssueNo.Article DueClose DateDate of ShowShowCoversCountryWhere
January/February24.15 Jan12 JanJan. 24 - 25, 2024NEPCON JapanJapanTokyo Big Sight
Jan. 31 - Feb. 2, 2024Semicon KoreaSouth KoreaSeoul
Feb. 6 - 8 , 2024Medical Design & ManufacturingUSAAnaheim, California
March24.29 Feb16 FebMarch 18 - 21, 2024IMAPS Device PackagingAPEX Preview IssueUSAWeKoPa, Arizona
March 20 - 22, 2024Productronica and Semicon ChinaChinaShanghai
March 20 -, 2024Electronica Manufacturing KoreaKoreaSeoul
April24.31 Mar8 MarApril 9 - 11, 2024APEX IPC ExpoAPEX Show IssueUSAAnaheim, California
April 24 - 26, 2024Nepcon ChinaChinaShanghai, China
May24.429 Mar5 AprMay 14 - 16, 2024Electronics in Harsh Enviroments Conference DenmarkLyngy, Denmark
May 28 - 30, 2024Semicon Southeast AsiaSMTConnect PreShow IssueMalaysiaPenang
June24.526 Apr3 MayJune 4 - 7, 2024PCB East Conference & ExpoUSABoxborough, MA
June 11 - 13, 2024SMTConnectSMTConnect Show IssueGermanyNuremburg
June 13, 2024eSmartTBDTBD
June 19 -20 2024Nepcon ThailandThailandKhwaeng Bang Na B
July/August24.630 May7 JunJuly 9 - 11. 2024Semicon WestSemicon Show Issue/BinUSASan Francisco CA
July 11 - 13, 2024Electronica ChinaChinaShanghai, China
August 28 - 30, 2024PCMI ChinaChinaShanghai, China
September24.72 Aug9 AugSeptember 4 - 6, 2024Semicon TaiwanSemicon Taiwan IssueTaiwanTaipei
September 11 - 14, 2024EMPC 2024SMTAI PreShow Issue UKCambridge
September 11 - 12, 2024Nepcon VietnamProductronica/Elect. Show IssueVietnamHanoi
SupplementSupp.30 Aug6 SepSeptember 11 - 12, 2024SMTA GuadalajaraSMTA Guadalajara Show IssueMexicoGuardalajara
SupplementSupp.2 Aug9 AugSeptember 11 - 13,  2024Productronica /Electronica IndiaProductronica/Elect. Show IssueIndiaNew Deli
October24.830 Aug6 SepOctober 21 - 24. 2024SMTA InternationalSMTA Show IssueUSARosemont, IL
November/December24.919 Oct25 OctNovember 6 - 8, 2024Nepcon AsiaSMTAI Show IssueChinaShenzhen
November 12 - 15, 2024Electronica GermanyAwards IssueGermanyMunich
December 4 - 6, 2024HKPCA ShowChinaShenzhen
December 11 - 13, 2024Semicon JapanJapanTokyo Big Sight, Tokyo, Japan

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Regular Coverage

Stencil Printing, Selective Soldering, Factory Automation, Low-Volume/ High-Mix Equipment, Rework and Repair, Thermal Interface Materials (TIMs), Chip Scale Packaging, Dispensing, Burework and Repair, ATE, Manufacturing Software, Vision Systems, MEMs, Bond Testing, VOC-Free Fluxes, BGA, Factory Robotics, Pick and Place, Bump Inspection, Flip Chip, Wafer Bumping, Printing, Die Bonders, Cleaning, 3D Printers, Die Placement, Reflow, Conformal Coatings, 3D Inspection, Wave Soldering, Counterfeit Components, WEEE & RoHS, Reflow, Depanelling, Routing, Handling Systems, Wire Bonding, Process Management Software, Rework Equipment, Advanced Substrates, 3D Circuits, Sensors, Bulk Feeders, Board Contamination, ESD Control, Testing 5G Boards, Preventing Warpage, Potting, Encapsulating and Underfilling, Low Temperature Solder Paste, Line Management Tools, Soldering for Harsh Environments, Cleaning and Surface Preparation.