Publishing Schedule

2023 International Schedule

IssueNo.Article DueClose DateDate of ShowShowCoversCountryWhere
January23.116 Dec6 JanJanuary 24-26, 2023APEX IPC ExpoAPEX Show IssueUSASan Diego, California
January23.2January 25-27, 2023NEPCON JapanJapanTokyo Big Sight
February13 Jan20 JanFebruary 1-3, 2023Semicon KoreaMD & M IssueKoreaSeoul
FebruaryFebruary 7-9, 2023Medical Design & ManufacturingUSAAnaheim, California
March23.33 Feb10 FebMarch 13-16, 2023IMAPS Device PackagingAPEX Post Show IssueUSAWeKoPa, Arizona
MarchMarch 22- 24, 2023Semicon ChinaSemicon China IssueChinaShanghai
MarchMarch 22-24, 2023Productronica ChinaChinaShanghai
April23.410 Mar17 MarApril 5-7, 2023Electronica Manufacturing KoreaSMTConnect PreShow IssueKoreaSeoul
AprilApril 13-15, 2023Electronica ChinaNepcon China IssueChinaShanghai
AprilApril 19-21, 2023Nepcon ChinaChinaSuzhou
May/June23.57 Apr14 AprMay 9-11, 2023PCB East Conference & ExpoSMTConnect Show IssueUSABoxborough, MA
May/JuneMay 9 - 11, 2023SMTConnectSemicon SEA IssueGermanyNuremburg
May/JuneMay 23 - 25, 2023Semicon Southeast AsiaMalaysiaPenang
May/JuneJune 21-24, 2023Nepcon ThailandThailandKhwaeng Bang Na B
July/August23.616 Jun23 JunJuly 11 - 13, 2023Semicon WestSemicon West IssueUSASemicon West Issue
July/AugustJuly 12 - 14, 2023EMEX - Electronics Manufacturing ExpoEMEX Supplement IssueMalaysiaPenang
September23.718 Aug25 AugSeptember 6- 8, 2023Semicon TaiwanSemicon Taiwan IssueTaiwanTaipei
SeptemberSeptember 11-14, 2023EMPC 2023SMTAI PreShow Issue UKCambridge
SeptemberSeptember 13 - 25, 2023Nepcon VietnamNepcon Vietnam SupplementVietnamHanoi
SeptemberSeparate18 Aug25 AugSeptember 13 - 15, 2023Productronica /Electronica indiaProductronica SupplementIndiaBangalura
OctoberSeparateOctober 25- 26. 2023SMTA GuadalajaraSMTA Guadalajara SupplementMexicoGuardalajara
October23.88 Sep15 SepOctober 9 - 12, 2023SMTA InternationalSMTAI Show IssueUSAMinneapolis MN
OctoberOctober 11 -13Nepcon AsiaProductronica PreShow IssueChinaShenzhen
November23.913 Oct20 OctNovember 14 - 17, 2023Productronica/Semicon EuropaProductronica IssueGermanyMunich
December23.1017 Nov24 NovDecember 13 - 15Semicon JapanAwards IssueJapanTokyo Big Sight, Tokyo, Japan
DecemberDecember 24 - 26, 2023HKPCAChinaShenzhen

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Regular Coverage

Stencil Printing, Selective Soldering, Factory Automation, Low-Volume/ High-Mix Equipment, Rework and Repair, Thermal Interface Materials (TIMs), Chip Scale Packaging, Dispensing, Burework and Repair, ATE, Manufacturing Software, Vision Systems, MEMs, Bond Testing, VOC-Free Fluxes, BGA, Factory Robotics, Pick and Place, Bump Inspection, Flip Chip, Wafer Bumping, Printing, Die Bonders, Cleaning, 3D Printers, Die Placement, Reflow, Conformal Coatings, 3D Inspection, Wave Soldering, Counterfeit Components, WEEE & RoHS, Reflow, Depanelling, Routing, Handling Systems, Wire Bonding, Process Management Software, Rework Equipment, Advanced Substrates, 3D Circuits, Sensors, Bulk Feeders, Board Contamination, ESD Control, Testing 5G Boards, Preventing Warpage, Potting, Encapsulating and Underfilling, Low Temperature Solder Paste, Line Management Tools, Soldering for Harsh Environments, Cleaning and Surface Preparation.