International Schedule
| Month | Issue | Articles Due | Close date | Show date | Show | Where | Special Editorial Coverage | ||
|---|---|---|---|---|---|---|---|---|---|
| Month | Date | ||||||||
| January | 23.1 | 16-Dec | 6-Jan | January | 24-26 | IPC APEX Show | San Diego, California | Industry Milestones IPC APEX Show Issue | |
| January | 25-27 | IPC APEX Expo | Tokyo Big Sight, Japan | ||||||
| February | 23.2 | 13-Jan | 20-Jan | February | 1-3 | Semicon Korea | Seoul, South Korea | MDM Issue | |
| February | 7-9 | Medical Design & Manufacturing | Anaheim, California | ||||||
| March | 23.3 | 10-Feb | 17-Feb | March | 13-16 | IMAPS Device Packaging | WeKoPa, Arizona | IMAPS Issue | |
| March | 22-24 | Semicon/Productronica China | Shanghai, China | ||||||
| April | 23.4 | 10-Mar | 17-Mar | April | 5-7 | Electronica Manufacturing Korea | Seoul, Korea | SMTconnect Preshow Issue | |
| April | 13-15 | Electronica China | Shanghai, China | ||||||
| April | 19-21 | Nepcon China | Suzhou, China | ||||||
| May/June | 23.5 | 4-Apr | 14-Apr | May | 9-11 | PCB East Conference & Expo | Boxborough, MA, USA | SMTconnect Show Issue | |
| May | 9-11 | SMTConnect | Nuremburg, Germany | ||||||
| May | 23-25 | SEMICON Southeast Asia | Penang, Malaysia | ||||||
| July/August | 23.6 | 16-June | 23-June | June | 21-24 | Nepcon Thailand | Khwaeng Bang Na B,Thailand | ||
| July | 11-13 | SEMICON West | San Francisco, CA, USA | ||||||
| July | 19-21 | Electronic Mfg Expo Malaysia | Penang, Malaysia | ||||||
| September | 23.7 | 18-Aug | 25-Aug | September | 6-8 | SEMICON Taiwan | Taiwan | SMTA Mexico and EP India Issue | |
| September | 21-22 | SMTA Guadalajara | Guadalajara, Mexico | ||||||
| September | 11-14 | EMPC 2023 | Cambridge, UK | ||||||
| September | 21-23 | Productronica /Electronica india | Delhi, India | ||||||
| October | 23.8 | 8-Sept | 15-Sept | October | 9-12 | SMTA International | Minneapolis, USA | SMTAi Issue Productronica Preview | |
| October | 11-13 | Nepcon Asia | Shenzhen, China | ||||||
| November | 23.9 | 13-Oct | 20-Oct | November | 14-17 | Productronica/SEMICON Europa | Munich, Germany | Productronica Issue | |
| December | 23.10 | 17-Nov | 24-Nov | December | 13-15 | Semicon Japan | Tokyo Big Sight, Tokyo, Japan | Awards Issue | |
| December | 24-26 | HKPCA | Shenzhen, China | ||||||
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Regular Coverage
Stencil Printing, Selective Soldering, Factory Automation, Low-Volume/ High-Mix Equipment, Rework and Repair, Thermal Interface Materials (TIMs), Chip Scale Packaging, Dispensing, Burework and Repair, ATE, Manufacturing Software, Vision Systems, MEMs, Bond Testing, VOC-Free Fluxes, BGA, Factory Robotics, Pick and Place, Bump Inspection, Flip Chip, Wafer Bumping, Printing, Die Bonders, Cleaning, 3D Printers, Die Placement, Reflow, Conformal Coatings, 3D Inspection, Wave Soldering, Counterfeit Components, WEEE & RoHS, Reflow, Depanelling, Routing, Handling Systems, Wire Bonding, Process Management Software, Rework Equipment, Advanced Substrates, 3D Circuits, Sensors, Bulk Feeders, Board Contamination, ESD Control, Testing 5G Boards, Preventing Warpage, Potting, Encapsulating and Underfilling, Low Temperature Solder Paste, Line Management Tools, Soldering for Harsh Environments, Cleaning and Surface Preparation.