Technical Articles

Submitting Technical Articles

Global SMT & Packaging focuses on a mixture of solution-led technical articles, op-ed columns and news items. Technical articles should inform and assist our readers in such a way that they learn how to improve their quality and reliability, increase their yield or save cost in their manufacturing facility.

Please have your colleagues thoroughly proof the article before you submit it to the editor.


We firmly believe that if a reader is interested in a technical article, he wants all the facts and we therefore try not to limit the length of articles. As a guide we would suggest that articles should not exceed 4,000 words, less 150 words per graph, image or table. If you need more space, then, subject to agreement with the editor, we will serialize the article over two or more issues.
For Short Articles or Case Studies, these should not exceed 1,500 words in length. For Columns or Op-Eds, the word count should not exceed 1,000 words and have at least one supporting image.


The title should describe the thrust of the article, accurately, concisely and free from any commercial name, term or bias. The title should not exceed 8 words in length.

Keywords and Tags

Up to 8 Keywords or #tags should be provided that accurately describe the subject matter contained in the article.


Supporting images, graphs and tables should be sent as separate 300dpi jpeg files. We also accept Adobe Photoshop (PSD), EPS, TIFF and Adobe Illustrator files.


In the first instance, please submit an Abstract (60 - 100 words) describing the article, it's contents and conclusions. Text should be submitted in MS Word with 1.5 line spacing.

Author's details

The first name, last name, qualification, company/institute name, city and country of up to two principal authors should appear on the line below the title. A professional, head and shoulders photo should also be provided, where possible as a 300dpi jpeg file.​

Body Text

Articles should be structured with an introduction, middle and conclusion and be supported by credible graphs, tables and images.


References are encouraged and give the reader a guide as to how well researched the article has been, over what period of time and from how many geographical, academic and industry-related sources. Where possible, please submit References in Harvard style.

Regular Coverage

Stencil Printing, Selective Soldering, Factory Automation, Low-Volume/ High-Mix Equipment, Rework and Repair, Thermal Interface Materials (TIMs), Chip Scale Packaging, Dispensing, Burework and Repair, ATE, Manufacturing Software, Vision Systems, MEMs, Bond Testing, VOC-Free Fluxes, BGA, Factory Robotics, Pick and Place, Bump Inspection, Flip Chip, Wafer Bumping, Printing, Die Bonders, Cleaning, 3D Printers, Die Placement, Reflow, Conformal Coatings, 3D Inspection, Wave Soldering, Counterfeit Components, WEEE & RoHS, Reflow, Depanelling, Routing, Handling Systems, Wire Bonding, Process Management Software, Rework Equipment, Advanced Substrates, 3D Circuits, Sensors, Bulk Feeders, Board Contamination, ESD Control, Testing 5G Boards, Preventing Warpage, Potting, Encapsulating and Underfilling, Low Temperature Solder Paste, Line Management Tools, Soldering for Harsh Environments, Cleaning and Surface Preparation.